Atomic layer deposition of molybdenum nitride diffusion barriers for Cu interconnects

P Alen, M Ritala, K Arstila, J Keinonen, T Sajavaara, M Leskela

Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

Original languageEnglish
Title of host publicationUnknown host publication
EditorsD Erb, P Ramm, K Masu, A Osaki
Number of pages6
Publication date2004
Pages763-768
Publication statusPublished - 2004
MoE publication typeA4 Article in conference proceedings

Fields of Science

  • COPPER METALLIZATION
  • THIN-FILMS
  • TOF-ERDA
  • EPITAXY
  • MO

Cite this

Alen, P., Ritala, M., Arstila, K., Keinonen, J., Sajavaara, T., & Leskela, M. (2004). Atomic layer deposition of molybdenum nitride diffusion barriers for Cu interconnects. In D. Erb, P. Ramm, K. Masu, & A. Osaki (Eds.), Unknown host publication (pp. 763-768)
Alen, P ; Ritala, M ; Arstila, K ; Keinonen, J ; Sajavaara, T ; Leskela, M. / Atomic layer deposition of molybdenum nitride diffusion barriers for Cu interconnects. Unknown host publication. editor / D Erb ; P Ramm ; K Masu ; A Osaki. 2004. pp. 763-768
@inproceedings{fbebece78e9d4ea498d0573f98ca3f52,
title = "Atomic layer deposition of molybdenum nitride diffusion barriers for Cu interconnects",
keywords = "COPPER METALLIZATION, THIN-FILMS, TOF-ERDA, EPITAXY, MO",
author = "P Alen and M Ritala and K Arstila and J Keinonen and T Sajavaara and M Leskela",
note = "Volume: Proceeding volume:",
year = "2004",
language = "English",
pages = "763--768",
editor = "D Erb and P Ramm and K Masu and A Osaki",
booktitle = "Unknown host publication",

}

Alen, P, Ritala, M, Arstila, K, Keinonen, J, Sajavaara, T & Leskela, M 2004, Atomic layer deposition of molybdenum nitride diffusion barriers for Cu interconnects. in D Erb, P Ramm, K Masu & A Osaki (eds), Unknown host publication. pp. 763-768.

Atomic layer deposition of molybdenum nitride diffusion barriers for Cu interconnects. / Alen, P; Ritala, M; Arstila, K; Keinonen, J; Sajavaara, T; Leskela, M.

Unknown host publication. ed. / D Erb; P Ramm; K Masu; A Osaki. 2004. p. 763-768.

Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

TY - GEN

T1 - Atomic layer deposition of molybdenum nitride diffusion barriers for Cu interconnects

AU - Alen, P

AU - Ritala, M

AU - Arstila, K

AU - Keinonen, J

AU - Sajavaara, T

AU - Leskela, M

N1 - Volume: Proceeding volume:

PY - 2004

Y1 - 2004

KW - COPPER METALLIZATION

KW - THIN-FILMS

KW - TOF-ERDA

KW - EPITAXY

KW - MO

M3 - Conference contribution

SP - 763

EP - 768

BT - Unknown host publication

A2 - Erb, D

A2 - Ramm, P

A2 - Masu, K

A2 - Osaki, A

ER -

Alen P, Ritala M, Arstila K, Keinonen J, Sajavaara T, Leskela M. Atomic layer deposition of molybdenum nitride diffusion barriers for Cu interconnects. In Erb D, Ramm P, Masu K, Osaki A, editors, Unknown host publication. 2004. p. 763-768