How do software companies deal with artificial intelligence ethics? A gap analysis

Ville Vakkuri; Kai-Kristian Kemell; Joel Tolvanen; Marianna Jantunen; Erika Halme; Pekka Abrahamson

doi:10.1145/3530019.3530030

How do software companies deal with artificial intelligence ethics? A gap analysis

Ville Vakkuri, Kai-Kristian Kemell, Joel Tolvanen, Marianna Jantunen, Erika Halme, Pekka Abrahamson

Department of Computer Science

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Scientific › peer-review

Original language	English
Title of host publication	Proceedings of the International Conference on Evaluation and Assessment in Software Engineering 2022
Editors	Miroslaw Staron, Christian Berger, Jocelyn Simmonds, Rafael Prikladnicki
Place of Publication	New York
Publisher	ACM
Publication date	Jun 2022
Pages	100–109
ISBN (Electronic)	978-1-4503-9613-4
DOIs	https://doi.org/10.1145/3530019.3530030
Publication status	Published - Jun 2022
MoE publication type	A4 Article in conference proceedings
Event	International Conference on Evaluation and Assessment in Software Engineering - Gothenburg, Sweden Duration: 13 Jun 2022 → 15 Jun 2022 Conference number: 26

Fields of Science

113 Computer and information sciences

Access to Document

10.1145/3530019.3530030Licence: Unspecified

3530019.3530030Final published version, 667 KBLicence: Unspecified

Cite this

Vakkuri, V., Kemell, K.-K., Tolvanen, J., Jantunen, M., Halme, E., & Abrahamson, P. (2022). How do software companies deal with artificial intelligence ethics? A gap analysis. In M. Staron, C. Berger, J. Simmonds, & R. Prikladnicki (Eds.), Proceedings of the International Conference on Evaluation and Assessment in Software Engineering 2022 (pp. 100–109). ACM . https://doi.org/10.1145/3530019.3530030

Vakkuri, Ville ; Kemell, Kai-Kristian ; Tolvanen, Joel et al. / How do software companies deal with artificial intelligence ethics? A gap analysis. Proceedings of the International Conference on Evaluation and Assessment in Software Engineering 2022. editor / Miroslaw Staron ; Christian Berger ; Jocelyn Simmonds ; Rafael Prikladnicki. New York : ACM , 2022. pp. 100–109

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Vakkuri, V, Kemell, K-K, Tolvanen, J, Jantunen, M, Halme, E & Abrahamson, P 2022, How do software companies deal with artificial intelligence ethics? A gap analysis. in M Staron, C Berger, J Simmonds & R Prikladnicki (eds), Proceedings of the International Conference on Evaluation and Assessment in Software Engineering 2022. ACM , New York, pp. 100–109, International Conference on Evaluation and Assessment in Software Engineering, Gothenburg, Sweden, 13/06/2022. https://doi.org/10.1145/3530019.3530030

How do software companies deal with artificial intelligence ethics? A gap analysis. / Vakkuri, Ville; Kemell, Kai-Kristian; Tolvanen, Joel et al.
Proceedings of the International Conference on Evaluation and Assessment in Software Engineering 2022. ed. / Miroslaw Staron; Christian Berger; Jocelyn Simmonds; Rafael Prikladnicki. New York: ACM , 2022. p. 100–109.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Scientific › peer-review

TY - GEN

T1 - How do software companies deal with artificial intelligence ethics? A gap analysis

AU - Vakkuri, Ville

AU - Kemell, Kai-Kristian

AU - Tolvanen, Joel

AU - Jantunen, Marianna

AU - Halme, Erika

AU - Abrahamson, Pekka

N1 - Conference code: 26

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DO - 10.1145/3530019.3530030

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BT - Proceedings of the International Conference on Evaluation and Assessment in Software Engineering 2022

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A2 - Berger, Christian

A2 - Simmonds, Jocelyn

A2 - Prikladnicki, Rafael

PB - ACM

CY - New York

T2 - International Conference on Evaluation and Assessment in Software Engineering

Y2 - 13 June 2022 through 15 June 2022

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Vakkuri V, Kemell KK, Tolvanen J, Jantunen M, Halme E, Abrahamson P. How do software companies deal with artificial intelligence ethics? A gap analysis. In Staron M, Berger C, Simmonds J, Prikladnicki R, editors, Proceedings of the International Conference on Evaluation and Assessment in Software Engineering 2022. New York: ACM . 2022. p. 100–109 doi: 10.1145/3530019.3530030