Low-Temperature Atomic Layer Deposition of Low-Resistivity Copper Thin Films Using Cu(dmap)(2) and Tertiary Butyl Hydrazine

Katja Väyrynen, Kenichiro Mizohata, Jyrki Räisänen, Daniel Peeters, Anjana Devi, Mikko Ritala, Markku Leskelä

Research output: Contribution to journalArticleScientificpeer-review

Original languageEnglish
JournalChemistry of Materials
Volume29
Issue number15
Pages (from-to)6502-6510
Number of pages9
ISSN0897-4756
DOIs
Publication statusPublished - 8 Aug 2017
MoE publication typeA1 Journal article-refereed

Fields of Science

  • CHEMICAL-VAPOR-DEPOSITION
  • HYDROGEN PLASMA
  • SEED LAYERS
  • AMIDINATE PRECURSOR
  • METAL-FILMS
  • HIGH-PURITY
  • ALD COPPER
  • CU
  • NITRIDE
  • GROWTH
  • 116 Chemical sciences
  • 114 Physical sciences

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