Original language | English |
---|---|
Journal | Microelectronics Reliability |
Volume | 54 |
Issue number | 9-10 |
Pages (from-to) | 1707-1711 |
Number of pages | 5 |
ISSN | 0026-2714 |
DOIs | |
Publication status | Published - 2014 |
MoE publication type | A4 Article in conference proceedings |
Event | European Symposium on the Reliability of Electron Devices, Failure Physics and Analysis (ESREF) - Berlin, Germany Duration: 29 Sept 2014 → 2 Oct 2014 Conference number: 25 |
Fields of Science
- Breakdown
- Reliability
- High-kappa
- Resistive switching
- SOFT BREAKDOWN
- DIODE EQUATION
- GATE OXIDES
- TEMPERATURE
- DEVICES
- SILICON
- LAYERS
- 116 Chemical sciences
- 114 Physical sciences