In-situ plasma treatment of Cu surfaces for reducing the generation of vacuum arc breakdowns

Anton Saressalo, Aarre Kilpeläinen, Kenichiro Mizohata, Iaroslava Profatilova, Anton Nolvi, Ivan Kassamakov, Pertti O. Tikkanen, Sergio Calatroni, Walter Wuensch, Flyura Djurabekova

Tutkimustuotos: ArtikkelijulkaisuArtikkeliTieteellinenvertaisarvioitu

Abstrakti

High electric fields are present in a rapidly growing number of applications, which include elementary particle accelerators, vacuum interrupters, miniature x-ray sources, and satellites. Many of these applications are limited by the breakdown strength of the materials exposed to electric fields. Different methods have been developed to improve the quality of metal electrode surfaces, aiming to increase their breakdown strength. Not many systematical studies have been performed to provide a proper understanding of what contributes to the correlation between the breakdown strength and the quality of the surface. In this work, we apply a novel method for reducing vacuum arc breakdowns by cleaning the electrode surfaces with O and Ar plasma. The method can be used to alter the surfaces of the Cu electrodes in situ, i.e., without exposing them to air between the measurements. This plasma cleaning treatment is shown to reduce the number of surface impurities and to speed up the conditioning process of the samples under high-voltage pulses. Specifically, the first breakdown field was observed to increase by more than 90% after the plasma cleaning.

Alkuperäiskielienglanti
Artikkeli143302
LehtiJournal of Applied Physics
Vuosikerta130
Numero14
Sivumäärä10
ISSN0021-8979
DOI - pysyväislinkit
TilaJulkaistu - 14 lokak. 2021
OKM-julkaisutyyppiA1 Alkuperäisartikkeli tieteellisessä aikakauslehdessä, vertaisarvioitu

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