@article{f148b1dfded04155b96c3aeb8e941215,
title = "Thermal stability of interface voids in Cu grain boundaries with molecular dynamic simulations",
keywords = "molecular dynamics, grain boundary diffusion, thermal stability, high temperatures, diffusion bonding, POINT-DEFECTS, DIFFUSION, METALS, CREEP, MECHANISMS, STRESS, MODEL, 114 Physical sciences",
author = "A. Xydou and S. Parviainen and M. Aicheler and F. Djurabekova",
year = "2016",
month = sep,
day = "7",
doi = "10.1088/0022-3727/49/35/355303",
language = "English",
volume = "49",
journal = "Journal of Physics. D, Applied Physics",
issn = "0022-3727",
publisher = "IOP Publishing",
number = "35",
}