Low-Temperature Atomic Layer Deposition of Low-Resistivity Copper Thin Films Using Cu(dmap)(2) and Tertiary Butyl Hydrazine

Forskningsoutput: TidskriftsbidragArtikelVetenskapligPeer review

Originalspråkengelska
TidskriftChemistry of Materials
Volym29
Utgåva15
Sidor (från-till)6502-6510
Antal sidor9
ISSN0897-4756
DOI
StatusPublicerad - 8 aug 2017
MoE-publikationstypA1 Tidskriftsartikel-refererad

Vetenskapsgrenar

  • 116 Kemi
  • 114 Fysik

Citera det här

@article{8256d2417d4f44599a9885a018029cef,
title = "Low-Temperature Atomic Layer Deposition of Low-Resistivity Copper Thin Films Using Cu(dmap)(2) and Tertiary Butyl Hydrazine",
keywords = "CHEMICAL-VAPOR-DEPOSITION, HYDROGEN PLASMA, SEED LAYERS, AMIDINATE PRECURSOR, METAL-FILMS, HIGH-PURITY, ALD COPPER, CU, NITRIDE, GROWTH, 116 Chemical sciences, 114 Physical sciences",
author = "Katja V{\"a}yrynen and Kenichiro Mizohata and Jyrki R{\"a}is{\"a}nen and Daniel Peeters and Anjana Devi and Mikko Ritala and Markku Leskel{\"a}",
year = "2017",
month = "8",
day = "8",
doi = "10.1021/acs.chemmater.7b02098",
language = "English",
volume = "29",
pages = "6502--6510",
journal = "Chemistry of Materials",
issn = "0897-4756",
publisher = "American Chemical Society",
number = "15",

}

Low-Temperature Atomic Layer Deposition of Low-Resistivity Copper Thin Films Using Cu(dmap)(2) and Tertiary Butyl Hydrazine. / Väyrynen, Katja; Mizohata, Kenichiro; Räisänen, Jyrki; Peeters, Daniel; Devi, Anjana; Ritala, Mikko; Leskelä, Markku.

I: Chemistry of Materials, Vol. 29, Nr. 15, 08.08.2017, s. 6502-6510.

Forskningsoutput: TidskriftsbidragArtikelVetenskapligPeer review

TY - JOUR

T1 - Low-Temperature Atomic Layer Deposition of Low-Resistivity Copper Thin Films Using Cu(dmap)(2) and Tertiary Butyl Hydrazine

AU - Väyrynen, Katja

AU - Mizohata, Kenichiro

AU - Räisänen, Jyrki

AU - Peeters, Daniel

AU - Devi, Anjana

AU - Ritala, Mikko

AU - Leskelä, Markku

PY - 2017/8/8

Y1 - 2017/8/8

KW - CHEMICAL-VAPOR-DEPOSITION

KW - HYDROGEN PLASMA

KW - SEED LAYERS

KW - AMIDINATE PRECURSOR

KW - METAL-FILMS

KW - HIGH-PURITY

KW - ALD COPPER

KW - CU

KW - NITRIDE

KW - GROWTH

KW - 116 Chemical sciences

KW - 114 Physical sciences

U2 - 10.1021/acs.chemmater.7b02098

DO - 10.1021/acs.chemmater.7b02098

M3 - Article

VL - 29

SP - 6502

EP - 6510

JO - Chemistry of Materials

JF - Chemistry of Materials

SN - 0897-4756

IS - 15

ER -