@article{3b903808e2d64583a6b1c5ba703561cc,
title = "Nondestructive Inspection of Buried Channels and Cavities in Silicon",
keywords = "Infrared (IR) imaging, microelectromechanical systems, optical interferometry, thickness measurement, MICRO-CHANNELS, FABRICATION, SU-8, MICROSTRUCTURES, SYSTEMS, 114 Physical sciences",
author = "Ivan Kassamakov and Kestutis Grigoras and Ville Heikkinen and Kalle Hanhijarvi and Juha Aaltonen and Sami Franssila and Edward Haeggstrom",
year = "2013",
month = apr,
doi = "10.1109/JMEMS.2012.2227460",
language = "English",
volume = "22",
pages = "438--442",
journal = "IEEE Journal of Microelectromechanical Systems",
issn = "1057-7157",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
number = "2",
}