Quality Control of Ultrasonic Bonding Tools Using a Scanning White Light Interferometer

Ville Heikkinen, Risto Kurppa, Henri Olavi Seppänen, Heikki Räikkönen, Juha Pekka Aaltonen, Ivan Vladislavov Kassamakov, Edward Haeggström

Forskningsoutput: Kapitel i bok/rapport/konferenshandlingKonferensbidragVetenskapligPeer review

Sammanfattning

Background, Motivation and Objective
Ultrasonic bonding is important in today’s microelectronics manufacturing. Small deviations to the designed profile in the bonding tool’s working surface increase the number of low quality bonds. High yield is important in applications such as single-point Tape Automated Bonds (spTAB) in the CERN-ALICE detector or wire-to-wire bonds in the ESA-Electric Sail. We have developed a
method to measure the profile of the bonding tool’s working surface and its wear during the bonding process in order to increase the yield.
Statement of Contribution/Methods
Scanning White Light Interferometry (SWLI) is an interferometric method that measures 3D surface profiles. Using a broadband light
source SWLI can interrogate step heights up to several millimeters with nanometer scale vertical resolution.
Results
We measured profiles of spTAB tools. The tools’ working surface should have two perpendicular grooves with uniform depth along
their length. SWLI measurements showed that some tools featured deviations in groove depth (Fig. 1). We also measured 3D profiles
of bonds made with such a non-spex tool and measured their strength with destructive pull force tests. These bonds featured a height outside the specifications (7 ± 1 μm), and were weaker than those made with an in-spex tool, which featured a maximum sustainable pull force of 12 ± 1 g.
Discussion and Conclusions
SWLI can characterize the accurate topology of the working surface of bonding tools with nm scale resolution in a few seconds. This
allows on-the-fly measurement of ultrasonic bonding tools used for high-end applications. It could be used either for quantitative
quality control when fabricating tools or to check tool wear during usage when bonding a large number of wires.

Originalspråkengelska
Titel på gästpublikation2010 IEEE International Ultrasonics Symposium
Antal sidor3
FörlagIEEE
Utgivningsdatumokt 2010
Sidor1428-1430
ISBN (tryckt)978-1-4577-0382-9
DOI
StatusPublicerad - okt 2010
MoE-publikationstypA4 Artikel i en konferenspublikation

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  • 114 Fysik

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Heikkinen, Ville ; Kurppa, Risto ; Seppänen, Henri Olavi ; Räikkönen, Heikki ; Aaltonen, Juha Pekka ; Kassamakov, Ivan Vladislavov ; Haeggström, Edward. / Quality Control of Ultrasonic Bonding Tools Using a Scanning White Light Interferometer. 2010 IEEE International Ultrasonics Symposium. IEEE, 2010. s. 1428-1430
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title = "Quality Control of Ultrasonic Bonding Tools Using a Scanning White Light Interferometer",
abstract = "Background, Motivation and Objective Ultrasonic bonding is important in today’s microelectronics manufacturing. Small deviations to the designed profile in the bonding tool’s working surface increase the number of low quality bonds. High yield is important in applications such as single-point Tape Automated Bonds (spTAB) in the CERN-ALICE detector or wire-to-wire bonds in the ESA-Electric Sail. We have developed a method to measure the profile of the bonding tool’s working surface and its wear during the bonding process in order to increase the yield. Statement of Contribution/Methods Scanning White Light Interferometry (SWLI) is an interferometric method that measures 3D surface profiles. Using a broadband light source SWLI can interrogate step heights up to several millimeters with nanometer scale vertical resolution. Results We measured profiles of spTAB tools. The tools’ working surface should have two perpendicular grooves with uniform depth along their length. SWLI measurements showed that some tools featured deviations in groove depth (Fig. 1). We also measured 3D profiles of bonds made with such a non-spex tool and measured their strength with destructive pull force tests. These bonds featured a height outside the specifications (7 ± 1 μm), and were weaker than those made with an in-spex tool, which featured a maximum sustainable pull force of 12 ± 1 g. Discussion and Conclusions SWLI can characterize the accurate topology of the working surface of bonding tools with nm scale resolution in a few seconds. This allows on-the-fly measurement of ultrasonic bonding tools used for high-end applications. It could be used either for quantitative quality control when fabricating tools or to check tool wear during usage when bonding a large number of wires.",
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Quality Control of Ultrasonic Bonding Tools Using a Scanning White Light Interferometer. / Heikkinen, Ville; Kurppa, Risto; Seppänen, Henri Olavi; Räikkönen, Heikki; Aaltonen, Juha Pekka; Kassamakov, Ivan Vladislavov; Haeggström, Edward.

2010 IEEE International Ultrasonics Symposium. IEEE, 2010. s. 1428-1430.

Forskningsoutput: Kapitel i bok/rapport/konferenshandlingKonferensbidragVetenskapligPeer review

TY - GEN

T1 - Quality Control of Ultrasonic Bonding Tools Using a Scanning White Light Interferometer

AU - Heikkinen, Ville

AU - Kurppa, Risto

AU - Seppänen, Henri Olavi

AU - Räikkönen, Heikki

AU - Aaltonen, Juha Pekka

AU - Kassamakov, Ivan Vladislavov

AU - Haeggström, Edward

N1 - Volume: Proceeding volume:

PY - 2010/10

Y1 - 2010/10

N2 - Background, Motivation and Objective Ultrasonic bonding is important in today’s microelectronics manufacturing. Small deviations to the designed profile in the bonding tool’s working surface increase the number of low quality bonds. High yield is important in applications such as single-point Tape Automated Bonds (spTAB) in the CERN-ALICE detector or wire-to-wire bonds in the ESA-Electric Sail. We have developed a method to measure the profile of the bonding tool’s working surface and its wear during the bonding process in order to increase the yield. Statement of Contribution/Methods Scanning White Light Interferometry (SWLI) is an interferometric method that measures 3D surface profiles. Using a broadband light source SWLI can interrogate step heights up to several millimeters with nanometer scale vertical resolution. Results We measured profiles of spTAB tools. The tools’ working surface should have two perpendicular grooves with uniform depth along their length. SWLI measurements showed that some tools featured deviations in groove depth (Fig. 1). We also measured 3D profiles of bonds made with such a non-spex tool and measured their strength with destructive pull force tests. These bonds featured a height outside the specifications (7 ± 1 μm), and were weaker than those made with an in-spex tool, which featured a maximum sustainable pull force of 12 ± 1 g. Discussion and Conclusions SWLI can characterize the accurate topology of the working surface of bonding tools with nm scale resolution in a few seconds. This allows on-the-fly measurement of ultrasonic bonding tools used for high-end applications. It could be used either for quantitative quality control when fabricating tools or to check tool wear during usage when bonding a large number of wires.

AB - Background, Motivation and Objective Ultrasonic bonding is important in today’s microelectronics manufacturing. Small deviations to the designed profile in the bonding tool’s working surface increase the number of low quality bonds. High yield is important in applications such as single-point Tape Automated Bonds (spTAB) in the CERN-ALICE detector or wire-to-wire bonds in the ESA-Electric Sail. We have developed a method to measure the profile of the bonding tool’s working surface and its wear during the bonding process in order to increase the yield. Statement of Contribution/Methods Scanning White Light Interferometry (SWLI) is an interferometric method that measures 3D surface profiles. Using a broadband light source SWLI can interrogate step heights up to several millimeters with nanometer scale vertical resolution. Results We measured profiles of spTAB tools. The tools’ working surface should have two perpendicular grooves with uniform depth along their length. SWLI measurements showed that some tools featured deviations in groove depth (Fig. 1). We also measured 3D profiles of bonds made with such a non-spex tool and measured their strength with destructive pull force tests. These bonds featured a height outside the specifications (7 ± 1 μm), and were weaker than those made with an in-spex tool, which featured a maximum sustainable pull force of 12 ± 1 g. Discussion and Conclusions SWLI can characterize the accurate topology of the working surface of bonding tools with nm scale resolution in a few seconds. This allows on-the-fly measurement of ultrasonic bonding tools used for high-end applications. It could be used either for quantitative quality control when fabricating tools or to check tool wear during usage when bonding a large number of wires.

KW - 114 Physical sciences

KW - ultrasonic bonding

KW - Scanning White Light Interferometry

KW - quality control

KW - microelectronics manufacturing

U2 - 10.1109/ULTSYM.2010.5935926

DO - 10.1109/ULTSYM.2010.5935926

M3 - Conference contribution

SN - 978-1-4577-0382-9

SP - 1428

EP - 1430

BT - 2010 IEEE International Ultrasonics Symposium

PB - IEEE

ER -

Heikkinen V, Kurppa R, Seppänen HO, Räikkönen H, Aaltonen JP, Kassamakov IV et al. Quality Control of Ultrasonic Bonding Tools Using a Scanning White Light Interferometer. I 2010 IEEE International Ultrasonics Symposium. IEEE. 2010. s. 1428-1430 https://doi.org/10.1109/ULTSYM.2010.5935926